Kit arrived and appears to consist of the surface mount components only, with a resistor, IC and the l2s pins as well. Remaining through hole components ( and possibly some others, haven't exhaustively checked) have to be separately sourced.
One of the pins on the through hole IC was broken in transit (padded envelope only) so that will need to be replaced.
Have become distracted from the necessary checking by the minuscule scale of everything. My soldering skills would not be up to it, especially with the ICs.
So after a bit of investigation I found this guide. One of the virtues of the reflow oven technique is that you don't have to be spot on with the application of the solder paste. The surface tension of the molten solder pulls it onto the pads.
Of course a stencil would be the easiest way to apply solder paste, but it might take longer to make one than to do it by hand with a syringe.
So looks like a toaster oven and thermocouple are going to be useful.
Now to check the parts.